Silicon Photonics for Terabit/s communication in Data Centers and Exascale Computers

Stéphane Bernabe (1) , Quentin Wilmart (1) , Kobi Hasharoni (2) , Karim Hassan (1, 3) , Yvain Thonnart (4) , Pierre Tissier (5) , Yohan Desieres (1) , Ségolène Olivier (1) , Tolga Tekin (6) , Bertrand Szelag (1)

1 DOPT - Département d'Optronique
2 DustPhotonics
3 III-V Lab - Alcatel-Thales III-V Lab
4 LFIM - Laboratoire Fonctions Innovantes pour circuits Mixtes
5 ST-CROLLES - STMicroelectronics [Crolles]
6 Fraunhofer IZM - Fraunhofer Institute for Reliability and Microintegration

Silicon Photonics Technology using sub micrometer SOI platform, which commercially emerged at the beginning of the century, has now gained market shares in the field of fiber optic interconnects, from Inter-to Intra-Data Center communications. With growing demands in terms of aggregated bandwidth, scalability, transceiver form factor, and cost, Silicon Photonics is expected to play a growing role, especially with the foreseeable need to co-package photonic transceivers with next generation Ethernet switches. This new paradigm will be possible only with an evolution of existing Silicon Photonics manufacturing platforms, in order to solve the challenges of 3D packaging, laser integration, reflow-compatible optical connectors and high efficiency, low footprint modulators. Achieving these challenges may pave the way to Terabit scale communications in Data Centers and High Performance Computing Systems (HPC).

Mots clés: Silicon Photonics; Photonic Integrated Circuit; Photonic Module; Transceiver; High speed interconnect; Optical Network on Chip; On-Board Module; System-In-Package; High Performance Computing

Domaines: Réseaux et télécommunications [cs.NI]

Stéphane Bernabe, Quentin Wilmart, Kobi Hasharoni, Karim Hassan, Yvain Thonnart, et al.. Silicon Photonics for Terabit/s communication in Data Centers and Exascale Computers. Solid-State Electronics, 2021, 179, pp.10.1016/j.sse.2020.107928. ⟨10.1016/j.sse.2020.107928⟩. ⟨cea-03463711⟩