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Journal Articles Applied Physics Letters Year : 2016

Interface water diffusion in silicon direct bonding

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Abstract

The kinetics of water diffusion through the gap formed by the direct bonding of two silicon wafers is studied using two different techniques. X-ray reflectivity is able to monitor the interface density changes associated with the water front progression. The water intake is also revealed through the defect creation upon annealing, creating a rim-like pattern whose extent also gives the water diffusion law. At room temperature, the kinetics observed by either technique are consistent with the Lucas-Washburn law for diffusion through a gap width smaller than 1 nm, excluding any significant no-slip layer thickness. Published by AIP Publishing.
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Dates and versions

cea-01851936 , version 1 (31-07-2018)

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M. Tedjini, Frank Fournel, Hubert Moriceau, V. Larrey, Didier Landru, et al.. Interface water diffusion in silicon direct bonding. Applied Physics Letters, 2016, 109 (11), pp.111603. ⟨10.1063/1.4962464⟩. ⟨cea-01851936⟩
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