Assessment of contribution of EHD to the cooling of power semiconductor devices immersed in dielectric liquids

Chencho Dorji (1) , Olivier Lesaint (1) , Rachelle Hanna (1) , Rabih Khazaka (2)

1 G2ELab - Laboratoire de Génie Electrique de Grenoble
2 Safran Tech

This paper presents an experimental study of EHD heat transfer enhancement in dielectric liquids, and an evaluation of its contribution to cooling of power electronic components. Heat transfer measurements are carried out in a vertical coaxial electrode system filled with benzyltoluene liquids. The influence of voltage wave shape (AC, DC, impulses), frequency, and liquid viscosity on heat transfer enhancement are measured. The optimal heat transfer occurs for a specific frequency with ac and impulse voltages, and liquids of lower viscosity. Unfortunately, in a typical power electronics module geometry (power diode on a ceramic substrate), almost no improvement of the diode cooling is recorded when this structure is filled with a liquid.

Mots clés: heat transfer; power modules; high voltage; high temperature; cooling; electrohydrodynamic (EHD); dielectric liquids

Domaines: Thermique [physics.class-ph]; Electronique

Chencho Dorji, Olivier Lesaint, Rachelle Hanna, Rabih Khazaka. Assessment of contribution of EHD to the cooling of power semiconductor devices immersed in dielectric liquids. 22nd IEEE International Conference on Dielectric Liquids (ICDL 2023), Jun 2023, Worcester, MA, United States. ⟨hal-04159293⟩