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Développement d'une méthodologie adaptée à l'industrie microélectronique pour la reconstruction topographique par imagerie SEM à faisceau inclinable

Abstract : With the advancement of microelectronics technologies, the architecture of electronic components is becoming increasingly complicated. However, knowledge of the dimensional characteristics of the structures is important in order to be able to understand and optimize the behavior of these components. This is why there is a need to develop rapid, non-destructive three-dimensional measurement methods.The scanning electron microscope (SEM) is widely used to carry out dimensional measurements because it responds to the problems of speed and non-destructivity. However, obtaining quantitative and precise three-dimensional information is a challenge.Thanks to an electron microscope whose electron beam can be tilted, it is possible to obtain images at different viewing angles. From the analysis of these images, the height and the sidewall angles of the observed pattern can be determined geometrically.However, since electronic imaging is the result of electron-matter interactions, it is important to understand the origin of the formation of SEM images, in order to be able to analyze them correctly. This is why a study was carried out using physical simulation software to observe and understand the impact of the topography of a pattern on the resulting SEM image.From these observations, metrics were created on the SEM images to analyze them quantitatively.A linear model was then created using physical simulations to estimate the topographic quantities from these metrics. It was then calibrated on real SEM measurements, by comparing them to three-dimensional reference measurements by atomic force microscopy (AFM). This model was created for the reconstruction of “line” type patterns in etched silicon. Thanks to this model, reconstructions of real patterns were made. Finally, work was started on the creation of a model for "trench" and "dense" type patterns in etched silicon.
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https://tel.archives-ouvertes.fr/tel-03016206
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Submitted on : Friday, November 20, 2020 - 12:02:27 PM
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Charles Valade. Développement d'une méthodologie adaptée à l'industrie microélectronique pour la reconstruction topographique par imagerie SEM à faisceau inclinable. Micro et nanotechnologies/Microélectronique. Université Grenoble Alpes [2020-..], 2020. Français. ⟨NNT : 2020GRALT015⟩. ⟨tel-03016206⟩

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