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How 3D integration technologies enable advanced compute node for Exascale-level High Performance Computing?

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cea-03759943 , version 1 (24-08-2022)

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D. Dutoit, P. Coudrain, P.-Y. Martinez, P. Vivet, J. Charbonnier, et al.. How 3D integration technologies enable advanced compute node for Exascale-level High Performance Computing?. 2020 IEEE International Electron Devices Meeting (IEDM), Dec 2020, San Francisco, United States. pp.15.3.1-15.3.4, ⟨10.1109/IEDM13553.2020.9372037⟩. ⟨cea-03759943⟩
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