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Brittle fracture studied by ultra-high-speed synchrotron X-ray diffraction imaging

Abstract : In situ investigations of cracks propagating at up to 2.5 km s −1 along an (001) plane of a silicon single crystal are reported, using X-ray diffraction megahertz imaging with intense and time-structured synchrotron radiation. The studied system is based on the Smart Cut process, where a buried layer in a material (typically Si) is weakened by microcracks and then used to drive a macroscopic crack (10 −1 m) in a plane parallel to the surface with minimal deviation (10 −9 m). A direct confirmation that the shape of the crack front is not affected by the distribution of the microcracks is provided. Instantaneous crack velocities over the centimetre-wide field of view were measured and showed an effect of local heating by the X-ray beam. The post-crack movements of the separated wafer parts could also be observed and explained using pneumatics and elasticity. A comprehensive view of controlled fracture propagation in a crystalline material is provided, paving the way for the in situ measurement of ultra-fast strain field propagation.
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https://hal-cea.archives-ouvertes.fr/cea-03744374
Contributor : Samuel Tardif Connect in order to contact the contributor
Submitted on : Tuesday, August 2, 2022 - 5:35:55 PM
Last modification on : Thursday, August 4, 2022 - 3:05:20 AM

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Antoine Petit, Sylvia Pokam, Frederic Mazen, Samuel Tardif, Didier Landru, et al.. Brittle fracture studied by ultra-high-speed synchrotron X-ray diffraction imaging. Journal of Applied Crystallography, International Union of Crystallography, 2022, 55 (4), pp.911-918. ⟨10.1107/S1600576722006537⟩. ⟨cea-03744374⟩

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