Conference Papers
Year : 2022
Contributeur MAP CEA : Connect in order to contact the contributor
https://hal-cea.archives-ouvertes.fr/cea-03740747
Submitted on : Friday, July 29, 2022-7:38:29 PM
Last modification on : Friday, August 5, 2022-3:38:55 AM
Dates and versions
Identifiers
- HAL Id : cea-03740747 , version 1
Cite
Xavier Garros, Perrine Batude, Claire Fenouillet-Beranger, Laurent Brunet, Camila Calvacante, et al.. Key low temperature processes for a silicon-based 3D sequential integration. 2022 IEEE SYMPOSIUM ON VLSI TECHNOLOGY AND CIRCUITS, Jun 2022, Honolulu, United States. ⟨cea-03740747⟩
28
View
0
Download