Key low temperature processes for a silicon-based 3D sequential integration

Xavier Garros; Perrine Batude; Claire Fenouillet-Beranger; Laurent Brunet; Camila Calvacante; Tadeu Mota Frutuoso; Remy Gassilloud; Mickael Ribotta; Laurent Brevard; Valerie Lapras; François Andrieu; Fréd Gaillard

Conference Papers Year : 2022

Key low temperature processes for a silicon-based 3D sequential integration

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1

Xavier Garros

Function : Author

Département Composants Silicium

Perrine Batude

Function : Author

Département Composants Silicium

Claire Fenouillet-Beranger

Function : Author

Laurent Brunet

Function : Author

Département Composants Silicium

Camila Calvacante

Function : Author

Tadeu Mota Frutuoso

Function : Author

Département Composants Silicium

Remy Gassilloud

Function : Author

Mickael Ribotta

Function : Author

Département Composants Silicium

Laurent Brevard

Function : Author

Département Composants Silicium

Valerie Lapras

Function : Author

Département Composants Silicium

François Andrieu

Function : Author

Fréd Gaillard

Function : Author

Domains

Engineering Sciences [physics] Micro and nanotechnologies/Microelectronics

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Submitted on : Friday, July 29, 2022-7:38:29 PM

Last modification on : Friday, August 5, 2022-3:38:55 AM

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cea-03740747 , version 1 (29-07-2022)

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HAL Id : cea-03740747 , version 1

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Xavier Garros, Perrine Batude, Claire Fenouillet-Beranger, Laurent Brunet, Camila Calvacante, et al.. Key low temperature processes for a silicon-based 3D sequential integration. 2022 IEEE SYMPOSIUM ON VLSI TECHNOLOGY AND CIRCUITS, Jun 2022, Honolulu, United States. ⟨cea-03740747⟩

Key low temperature processes for a silicon-based 3D sequential integration

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