Skip to Main content Skip to Navigation
Conference papers

Key low temperature processes for a silicon-based 3D sequential integration

Complete list of metadata

https://hal-cea.archives-ouvertes.fr/cea-03740747
Contributor : Contributeur MAP CEA Connect in order to contact the contributor
Submitted on : Friday, July 29, 2022 - 7:38:29 PM
Last modification on : Friday, August 5, 2022 - 3:38:55 AM

Identifiers

  • HAL Id : cea-03740747, version 1

Collections

Citation

Xavier Garros, Perrine Batude, Claire Fenouillet-Beranger, Laurent Brunet, Camila Calvacante, et al.. Key low temperature processes for a silicon-based 3D sequential integration. 2022 IEEE SYMPOSIUM ON VLSI TECHNOLOGY AND CIRCUITS, Jun 2022, Honolulu, United States. ⟨cea-03740747⟩

Share

Metrics

Record views

0