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Key low temperature processes for a silicon-based 3D sequential integration

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https://hal-cea.archives-ouvertes.fr/cea-03727300
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Submitted on : Tuesday, October 11, 2022 - 5:47:24 PM
Last modification on : Thursday, October 13, 2022 - 3:38:27 AM

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  • HAL Id : cea-03727300, version 1

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Xavier Garros, Perrine Batude, Claire Fenouillet-Beranger, Laurent Brunet, Camila Calvacante, et al.. Key low temperature processes for a silicon-based 3D sequential integration. 2022 IEEE SYMPOSIUM ON VLSI TECHNOLOGY AND CIRCUITS, Jun 2022, Honolulu, United States. ⟨cea-03727300⟩

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