Alternative metrology for CMP performances measurement in 3D hybrid bonding

Viorel Balan (1, 2) , Yorrick Exbrayat (2) , Daniel Scevola (2)

1 DPFT - Département Plate-Forme Technologique
2 CEA-LETI - Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information

While BEOL CMP is a mature process, CMP for 3D hybrid bonding is much more challenging: Cu pad size is bigger while topography constraints are much more aggressive in order to avoid critical bonding voids

Domaines: Micro et nanotechnologies/Microélectronique

Viorel Balan, Yorrick Exbrayat, Daniel Scevola. Alternative metrology for CMP performances measurement in 3D hybrid bonding. 2021 CAMP CMP Symposium - 24th International Symposium on Chemical-Mechanical Planarization, Aug 2021, Clarkson University (virtual event), United States. ⟨cea-03689190⟩