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Alternative metrology for CMP performances measurement in 3D hybrid bonding

Abstract : While BEOL CMP is a mature process, CMP for 3D hybrid bonding is much more challenging: Cu pad size is bigger while topography constraints are much more aggressive in order to avoid critical bonding voids
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https://hal-cea.archives-ouvertes.fr/cea-03689190
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Submitted on : Tuesday, June 7, 2022 - 9:00:14 AM
Last modification on : Thursday, June 9, 2022 - 3:23:21 AM
Long-term archiving on: : Thursday, September 8, 2022 - 6:11:11 PM

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  • HAL Id : cea-03689190, version 1

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Viorel Balan, Yorrick Exbrayat, Daniel Scevola. Alternative metrology for CMP performances measurement in 3D hybrid bonding. 2021 CAMP CMP Symposium - 24th International Symposium on Chemical-Mechanical Planarization, Aug 2021, Clarkson University (virtual event), United States. ⟨cea-03689190⟩

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