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Conference Papers Year : 2021

Alternative metrology for CMP performances measurement in 3D hybrid bonding

Abstract

While BEOL CMP is a mature process, CMP for 3D hybrid bonding is much more challenging: Cu pad size is bigger while topography constraints are much more aggressive in order to avoid critical bonding voids
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Dates and versions

cea-03689190 , version 1 (07-06-2022)

Identifiers

  • HAL Id : cea-03689190 , version 1

Cite

Viorel Balan, Yorrick Exbrayat, Daniel Scevola. Alternative metrology for CMP performances measurement in 3D hybrid bonding. 2021 CAMP CMP Symposium - 24th International Symposium on Chemical-Mechanical Planarization, Aug 2021, Clarkson University (virtual event), United States. ⟨cea-03689190⟩
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