A D-band multi-channel Tx System-in-Package achieving 84.48 Gb/s with 64-QAM based on 45nm CMOS and low-Cost PCB technology - Archive ouverte HAL Access content directly
Journal Articles IEEE Transactions on Microwave Theory and Techniques Year : 2022

A D-band multi-channel Tx System-in-Package achieving 84.48 Gb/s with 64-QAM based on 45nm CMOS and low-Cost PCB technology

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Abstract

A high data-rate D-band transmitter module cointegrating a dual channel transmitter IC in 45 nm CMOS PDSOI technology and an antenna is presented. The proposed system-inpackage is based on an innovative channel bonding technique and is fabricated using a low-cost printed circuit board process. The IC consists of two up-conversion chains including on-chip millimeter-wave local oscillator generators. The emitted signal is composed of eight channels, each one having 2.16 GHz bandwidth, organized in two sets of 4 channels at the IF band (around 61.56 GHz) that are up-converted to two adjacent sub-bands centered at 148 GHz. Then, the two sub-band signals are combined off-chip using a substrate integrated waveguide diplexer and radiated by a patch antenna array realized on the same package. The output spans from 139.3 to 156.6 GHz. The total equivalent isotropic radiated power is 8.3 dBm. A 84.48 Gb/s data rate is achieved with 64 QAM. The module consumes 600 mW from a 1-V supply and occupies a compact area of 12×6 mm$^2$ .
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Dates and versions

cea-03637109 , version 1 (02-05-2022)

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Abdelaziz Hamani, Francesco Foglia Manzillo, Alexandre Siligaris, Nicolas Cassiau, Benjamin Blampey, et al.. A D-band multi-channel Tx System-in-Package achieving 84.48 Gb/s with 64-QAM based on 45nm CMOS and low-Cost PCB technology. IEEE Transactions on Microwave Theory and Techniques, inPress, ⟨10.1109/TMTT.2022.3162296⟩. ⟨cea-03637109⟩
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