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Experimental study of post-crack vibrations in dynamic fracture

Abstract : Vibrations induced by crack propagation in a strip of bonded silicon wafers are studied. A new optical setup enables the fast recording of crack-originated acoustic waves, emitted both ahead and behind the crack front, in bonded and separated wafers, respectively. Three types of crack-induced vibrations are identified, corresponding to different excitations and responses of the system: (1) “pneumatic” vibrations involving inertia and gas expansion/compression, (2) standard flexural waves involving inertia and bending rigidity, and (3) post-crack vibrations involving inertia, bending rigidity, and coupling to gas pressure. We show that a standard “beam on elastic foundation” model can explain these latter vibrations that occur along crack edges and is consistent with the observed frequencies.
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https://hal-cea.archives-ouvertes.fr/cea-03224214
Contributor : Samuel Tardif <>
Submitted on : Tuesday, May 11, 2021 - 2:45:57 PM
Last modification on : Thursday, May 13, 2021 - 3:26:07 AM

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Pauline Ronseaux, Florence Madeira, Frédéric Mazen, Didier Landru, Oleg Kononchuck, et al.. Experimental study of post-crack vibrations in dynamic fracture. Journal of Applied Physics, American Institute of Physics, 2021, 129, pp.185103. ⟨10.1063/5.0047626⟩. ⟨cea-03224214⟩

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