Technology Roadmap for Beyond 5G Wireless Connectivity in D-band

Jean-Baptiste Doré (1) , Didier Belot (1) , Eric Mercier (1) , Simon Bicaïs (1) , Gregory Gougeon (2) , Yoann Corre (3) , Benoit Miscopein (1) , Dimitri Kténas (1) , Emilio Calvanese Strinati (1)

1 CEA-LETI - Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information
2 SIRADEL
3 SIRADEL

Wireless communication in millimeter wave bands, namely above 20 GHz and up to 300 GHz is foreseen as a key enabler technology for the next generation of wireless systems. The huge available bandwidth is contemplated to achieve high data rate wireless communications, and hence, to fulfill the requirements of future wireless networks. Several Beyond 5G applications are considered for these systems: high capacity back-haul, enhanced hot-spot kiosk as well as short-range Device-to-Device communications. In this paper we propose to discuss the trade-offs between scenario requirements and current silicon technologies limits to draw a technology roadmap for the next generation of wireless connectivity in D-band.

Mots clés: Millimeter wave communications; Integrated circuit technology; Radiofrequency integrated circuits

Domaines: Micro et nanotechnologies/Microélectronique; Traitement du signal et de l'image [eess.SP]

Jean-Baptiste Doré, Didier Belot, Eric Mercier, Simon Bicaïs, Gregory Gougeon, et al.. Technology Roadmap for Beyond 5G Wireless Connectivity in D-band. 6G summit, Mar 2020, Levi, Finland. ⟨cea-02466751⟩