Hybrid integration of carbon nanotubes in silicon photonic resonators

Abstract : On-chip integration of all photonic components in the silicon platform is an important goal to accomplish high efficiency, low energy consumption, low cost and device miniaturization. However, silicon does not have efficient light emission or detection in the telecommunication wavelength range (close to 1.3$\mu$m and 1.55$\mu$m). Hence, hybrid integration of III-V materials or germanium is commonly adopted for the implementation of lasers and photodetectors. Nevertheless, these heterogeneous integration schemes compromise the low cost of using silicon.