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A 256 energy bin spectrum X-ray photon-counting image sensor providing 8Mcounts/s/pixel and on-chip charge sharing, charge induction and pile-up corrections

Abstract : To achieve better and faster material discrimination in applications like security inspection, X-Ray image sensors giving a highly resolved energy spectrum per pixel are required. In this paper, a new pixel architecture for spectral imaging is presented, exhibiting a 256 bin spectrum per pixel in a single image duration, up to two orders of magnitude higher than previous works. A prototype circuit, composed of 4x8 pixels of 756$\mu$mx800$\mu$m and hybridized to a CdTe crystal, was fabricated in a 0.13$\mu$m process. Our pixel architecture has been measured at 8 Mcounts/s/pixel while embedding on-chip charge sharing, charge induction and pile-up corrections
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https://hal-cea.archives-ouvertes.fr/cea-02194515
Contributor : Bruno Savelli <>
Submitted on : Thursday, July 25, 2019 - 3:53:25 PM
Last modification on : Thursday, June 11, 2020 - 5:04:09 PM

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A. Peizerat, J-P. Rostaing, P. Ouvrier-Buffet, S. Stanchina, P. Radisson, et al.. A 256 energy bin spectrum X-ray photon-counting image sensor providing 8Mcounts/s/pixel and on-chip charge sharing, charge induction and pile-up corrections. 2017 Symposium on VLSI Circuits (978-4-86348-606-5), Jun 2017, Kyoto, Japan. pp.C246-C247, ⟨10.23919/VLSIC.2017.8008496⟩. ⟨cea-02194515⟩

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