K. Abadie, P. Montmeat, T. Enot, F. Fournel, M. Wimplinger. Application of temporary adherence to improve the manufacturing of 3D thin silicon wafers.
International Journal of Adhesion and Adhesives, Elsevier, 2019, 91, pp.123-130.
⟨10.1016/j.ijadhadh.2019.03.009⟩.
⟨cea-02186447⟩