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Polymer bonding temperature impact on bonded stack morphology and adherence energy

Abstract : This paper deals with the effect of the silicon bonding temperature with thermoplastic adhesive. The bonding temperature exhibits a significant effect on the morphology and on the adherence energy of the bonded stack. A suitable temperature control leads to an excellent homogeneity of the bonded structure and an optimal total thickness variation (TTV) value. Using Brewer Bsi5150 adhesive material, 275 A degrees C appears as the optimal bonding temperature in order to optimize the TTV from 55 A mu m down to 5 A mu m. The adherence of the structure is also increased with high bonding temperatures. Indeed, the adherence energy is above 10 J/m(2) when the temperature is above 250 A degrees C. On the contrary, when the temperature is less than 150 A degrees C, the adherence is only around 1 J/m(2). Noteworthy, this value is suitable for back side processing and a mechanical debonding of the structure without any need of other specific layer which could lead to a very simple temporary bonding process.
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https://hal-cea.archives-ouvertes.fr/cea-02186140
Contributor : Marianne Leriche <>
Submitted on : Wednesday, July 17, 2019 - 10:14:58 AM
Last modification on : Thursday, June 11, 2020 - 5:04:08 PM

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P. Montmeat, T. Enot, G. Louro de Oliveira, F. Fournel. Polymer bonding temperature impact on bonded stack morphology and adherence energy. Microsystem Technologies, Springer Verlag, 2018, 24 (1), pp.793-799. ⟨10.1007/s00542-017-3519-1⟩. ⟨cea-02186140⟩

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