J. Millan, P. Godignon, X. Perpina, A. Perez-tomas, and J. Rebollo, A Survey of Wide Bandgap Power Semiconductor Devices, IEEE Transactions on Power Electronics, vol.29, issue.5, pp.2155-2163, 2014.

K. Pedersen, D. Nielsen, B. Czerny, G. Khatibi, F. Iannuzzo et al., Wire bond degradation under thermo and pure mechanical loading, Microelectron. Reliability, pp.373-377, 2017.

U. Choi, S. Jorgensen, and F. Blaabjerg, Advanced Accelerated Power Cycling Test for Reliability Investigation of Power Device Modules, IEEE Transactions on Power Electronics, vol.31, issue.12, pp.8371-8386, 2016.

W. Sabbah, P. Bondue, O. Avino-salvado, C. Buttay, H. Fremont et al., High temperature ageing of microelectronics assemblies with SAC solder joints, Microelectronics Reliability, pp.362-367, 2017.
URL : https://hal.archives-ouvertes.fr/hal-01564755

X. Liu and G. Lu, Power Chip Interconnection: From Wirebonding to Area Bonding, Int. Journal of Microcircuits and Electronic Packaging, vol.23, issue.4, pp.407-413, 2000.

R. Amro, Packaging and Interconnection Technologies of Power Devices, Challenges and Future Trends, International Journal of Electrical and Computer Engineering, vol.3, issue.1, pp.41-44, 2009.

K. Kroics, J. Zakis, and U. Sirmelis, Multiphase interleaved DC-DC converter with directly and inversely coupled inductors, IEEE 57 th RTUCON Proceedings, 2016.

J. Imaoka, S. Kimura, W. Martinez, and M. Yamamoto, A Novel Integrated Magnetic Core Structure Suitable for Transformer-Linked Interleaved Boost Chopper Circuit, IEEJ Journal of Industry Applications, vol.3, issue.5, pp.395-404, 2014.

E. Vagnon, P. O. Jeannin, J. Crebier, and Y. Avenas, A bus-barlike power module based on three-dimensional power-chip-on-chip hybrid integration, IEEE Transactions on Industry Applications, vol.46, issue.5, pp.2046-2055, 2010.

K. Vladimirova, J. Crebier, Y. Avenas, and C. Schaeffer, Single Die Multiple 600 V Power Diodes With Deep Trench Terminations and Isolation, IEEE Transactions on Power Electronics, vol.26, issue.11, pp.3423-3429, 2011.
URL : https://hal.archives-ouvertes.fr/hal-00709834

B. Letowski, J. Widiez, M. Rabarot, W. Vandendaele, B. Imbert et al., Towards vertical power device 3D packaging on 8-inch wafer, pp.135-138, 2016.
URL : https://hal.archives-ouvertes.fr/hal-01362296

P. Gondcharton, F. Baudin, L. Benaissa, and B. Imbert, Mechanisms overview of Thermocompression Process for Copper Metal Bonding, MRS Proceedings, vol.1559, pp.13-1559, 2013.

P. Gondcharton, B. Imbert, L. Benaissa, and M. Verdier, Voiding Phenomena in Copper-Copper Bonded Structures: Role of Creep, ECS Transactions, vol.64, issue.5, pp.357-367, 2014.
URL : https://hal.archives-ouvertes.fr/hal-01211317