Solderless Leadframe Assisted Wafer-Level Packaging Technology for Power Electronics

Kremena Vladimirova (1) , Julie Widiez (1) , Bastien Letowski (1) , Pierre Perreau (1) , Gregory Enyedi (1) , Perceval Coudrain (1) , Nicolas Clément, Jean-Paul Rouger (2) , Jean-Christophe Crebier (2)

1 CEA-LETI - Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information
2 G2ELab - Laboratoire de Génie Electrique de Grenoble

This paper presents a wafer-level pre-packaging technology for power devices. The concept consists in the implementation of a thick 3D patterned copper leadframe ensuring the interconnections of the power devices among them or with the other components of the converter. The metallic leadframe is bonded between two wafers of semiconductor devices enabling the 3D power module integration by the 3D stacking of one or multiple switching cells. Specific technology developments are introduced, practical realizations of the concept are presented and the electrical characterizations of the first prototypes are discussed

Keywords: 3D power module; wire bondless module; solderless module; power electronics; wafer-level packaging; die-level packaging; metallic leadframe; direct copper bonding

Domains: Micro and nanotechnologies/Microelectronics

Kremena Vladimirova, Julie Widiez, Bastien Letowski, Pierre Perreau, Gregory Enyedi, et al.. Solderless Leadframe Assisted Wafer-Level Packaging Technology for Power Electronics. 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), May 2018, San Diego, France. pp.1251-1257, ⟨10.1109/ECTC.2018.00193⟩. ⟨cea-02185324⟩