S. Bhunia, S. Ray, and S. Sur-kolay, Fundamentals of IP and SoC Security, 2016.

M. Semeria, Symbiotic Low-Power, Smart and Secure Technologies In the Age of Hyperconnectivity, IEEE 62 nd International Electron Devices Meeting (IEDM), pp.9-22, 2016.

K. Daniluk and E. Niewiadomska-szynkiewicz, Energy-Efficient Security in Implantable Medical Devices, Federated Conference on Computer Science and Information Systems (FedCSIS), pp.773-778, 2012.

E. Ronen, C. O'flynny, A. Shamir, and A. Weingarten, IoT Goes Nuclear : Creating a ZigBee Chain Reaction, IACR Cryptology ePrint Archive, vol.1047, pp.195-212, 2016.

A. Krakovinsky, M. Bocquett, R. Wacquez, J. Coignus, D. Deleruyelle et al., Impact of a Laser Pulse On Hf02-based RRAM Cells Reliability and Integrity, International Conference on Microelectronic Test Structures (ICMTS), pp.152-156, 2016.

R. Schlangen, R. Leihkauf, U. Kerst, C. Boit, and B. Kruger, Functional IC Analysis Through Chip Backside With Nano Scale Resolution -E-Beam Probing in FIB Trenches to STI Level, International Symposium on the Physical and Failure Analysis of Integrated Circuits, pp.35-38, 2007.

S. Manich, M. S. Wamser, and G. Sigl, Detection of Probing Attempts in Secure ICs, IEEE International Symposium on Hardware-Oriented Security and Trust (HOST), pp.134-139, 2012.

C. Helfmeier, D. Nedospasov, C. Tarnovsky, J. Krissler, C. Boit et al., Breaking and entering through the silicon, Proc. of the 20th ACM conference on Computer and communications security, pp.733-744, 2013.

C. Boit, S. Tajik, P. Scholz, E. Amini, A. Beyreuther et al., From IC Debug to Hardware Security Risk: The Power of Backside Access and Optical Interaction, IEEE 23 rd Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), pp.365-369, 2016.

D. Nedospasov, Attacking Microchips through the Backside, 15 th PacSec Conference, 2013.

S. Manich, D. Arumi, and R. Rodriguez-montanes, Backside Polishing Detector: A New Protection Against Backside Attacks, Conference on Design of Circuits and Integrated Systems (DCIS), pp.1-6, 2015.

S. Borel, E. Deschaseaux, J. Charbonnier, . Ph, S. Medina et al., Backside Shield against Physical Attacks for Secure ICs, pp.1-15, 2017.

J. Yeom, Y. Wu, and M. A. Shannon, Critical Aspect Ratio Dependence in Deep Reactive Ion Etching of Silicon, 12 th International Conference on Solid State Sensors, Actuators and Microsystems (Transducers), pp.1631-1634, 2003.

G. De-with and H. H. Wagemans, Ball-on-Ring Test Revesited, J. Am. Ceram. Soc, vol.72, pp.1538-1541, 1989.

J. Zhao, J. Tellkamp, V. Gupta, and D. Edwards, Experimental Evaluations of the Strength of Silicon Die by 3-Point-Bend Versus Ball-on-Ring Tests, IEEE Trans. Electron. Packag. Manuf, vol.32, issue.4, pp.248-255, 2009.