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Next generation image sensor via direct hybrid bonding

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cea-02156720 , version 1 (14-06-2019)

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  • HAL Id : cea-02156720 , version 1

Cite

L. Benaissa, L. Di Cioccio, Y. Beilliard, P. Coudrain, S. Dominguez, et al.. Next generation image sensor via direct hybrid bonding. 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), Dec 2015, Singapore, France. pp.1-3. ⟨cea-02156720⟩
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