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Next generation image sensor via direct hybrid bonding

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https://hal-cea.archives-ouvertes.fr/cea-02156720
Contributor : Lea Di Cioccio <>
Submitted on : Friday, June 14, 2019 - 4:06:45 PM
Last modification on : Tuesday, October 6, 2020 - 12:44:03 PM

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  • HAL Id : cea-02156720, version 1

Citation

L. Benaissa, L. Di Cioccio, Y. Beilliard, P. Coudrain, S. Dominguez, et al.. Next generation image sensor via direct hybrid bonding. 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), Dec 2015, Singapore, France. pp.1-3. ⟨cea-02156720⟩

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