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Next generation image sensor via direct hybrid bonding

L. Benaissa 1 L. Di Cioccio 1 Y. Beilliard 2 P. Coudrain 3 S. Dominguez V. Balan 1 T. Enot 1 B. Imbert 1 L. Millet S. Chevobbe 4 
1 CEA-LETI - Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information
2 LN2 - Laboratoire Nanotechnologies Nanosystèmes
3 STMicroelectronics
4 LIST (CEA) - Laboratoire d'Intégration des Systèmes et des Technologies
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Conference papers
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https://hal-cea.archives-ouvertes.fr/cea-02156720
Contributor : Lea Di Cioccio Connect in order to contact the contributor
Submitted on : Friday, June 14, 2019 - 4:06:45 PM
Last modification on : Thursday, August 4, 2022 - 5:14:54 PM

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  • HAL Id : cea-02156720, version 1

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CEA | CNRS | INSA-LYON | EC-LYON | DRT | UNIV-PARIS-SACLAY | LETI | LIST | LN2 | INSA-GROUPE | CEA-GRE | UDL | GS-ENGINEERING | GS-COMPUTER-SCIENCE

Citation

L. Benaissa, L. Di Cioccio, Y. Beilliard, P. Coudrain, S. Dominguez, et al.. Next generation image sensor via direct hybrid bonding. 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), Dec 2015, Singapore, France. pp.1-3. ⟨cea-02156720⟩

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