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https://hal-cea.archives-ouvertes.fr/cea-02156720
Submitted on : Friday, June 14, 2019-4:06:45 PM
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- HAL Id : cea-02156720 , version 1
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L. Benaissa, L. Di Cioccio, Y. Beilliard, P. Coudrain, S. Dominguez, et al.. Next generation image sensor via direct hybrid bonding. 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), Dec 2015, Singapore, France. pp.1-3. ⟨cea-02156720⟩
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