Diamond micro-electrode arrays (MEAs): A new route for in-vitro applications

Myline Cottance 1 Sebastien Nazeer 1 Rousseau Lionel 1 Gaelle Lissorgues 1 Alexandre Bongrain 2 Raphael Kiran 2 Emmanuel Scorsone 2 Philippe Bergonzo 2 Amel Bendali 3 Serge Picaud 3 Sébastien Joucla 4 Blaise Yvert 4
1 ESYCOM - Electronique, Systèmes de communication et Microsystèmes
2 LCD-LIST - Laboratoire Capteurs Diamant
DM2I - Département Métrologie Instrumentation & Information : DRT/LIST/DM2I
3 Institut de la Vision
4 INCIA - Institut de Neurosciences cognitives et intégratives d'Aquitaine
Abstract : Microelectrode arrays (MEAs) are extracellular devices allowing both recording and electrical stimulation of neuronal or cardiac cells. Interfacing cellular networks with MEAs leads to a better knowledge and understanding of the mechanisms of biological tissue and can be used for restorative purposes using neural prosthesis. We report the fabrication of in vitro 8×8 and 4×15 planar boron-doped nanocrystalline diamond (BNCD) MEAs using microtechnology. The BNCD for our MEA electrodes have been characterized electrochemically and we show that these devices offer good recording properties as compared to other standard electrode materials (such as Ti-Pt or Au).
Keywords : recording electrical stimulation microelectrode arrays neural network diamond electrode Retina Metals Materials Electric potential Extracellular bioelectric phenomena biomedical electrodes cardiology cellular biophysics diamond electrochemistry microelectrodes nanofabrication nanomedicine nanoparticles neurophysiology prosthetics diamond microelectrode arrays MEA in-vitro applications extracellular devices neuronal cells cardiac cells cellular network interfacing biological tissue restorative purposes neural prosthesis boron-doped nanocrystalline diamond BNCD microtechnology recording properties
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Myline Cottance, Sebastien Nazeer, Rousseau Lionel, Gaelle Lissorgues, Alexandre Bongrain, et al.. Diamond micro-electrode arrays (MEAs): A new route for in-vitro applications. 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), Apr 2013, Barcelona, Spain. ⟨cea-01842332⟩

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