Moderately reverberant learning ultrasonic pinch panel

Jean-Pierre Nikolovski 1, 2
1 LIS - Laboratoire Interfaces Sensorielles
DIASI - Département Intelligence Ambiante et Systèmes Interactifs : DRT/LIST/DIASI
Abstract : Tactile sensing is widely used in human-computer interfaces. However, mechanical integration of touch technologies is often perceived as difficult by engineers because it often limits the freedom of style or form factor requested by designers. Recent work in active ultrasonic touch technologies has made it possible to transform thin glass plates, metallic sheets, or plastic shells into interactive surfaces. The method is based on a learning process of touch-induced, amplitude-disturbed diffraction patterns. This paper proposes, first, an evolution in the design with multiple dipole transducers that improves touch sensitivity or maximum panel size by a factor of ten, and improves robustness and usability in moderately reverberant panels, and second, defines a set of acoustic variables in the signal processing for the evaluation of sensitivity and radiating features. For proof of concept purposes, the design and process are applied to 3.2- and 6-mm-thick glass plates with variable damping conditions. Transducers are bonded to only one short side of the rectangular substrates. Measurements show that the highly sensitive free lateral sides are perfectly adapted for pinch-touch and pinch-slide interactions. The advantage of relative versus absolute touch disturbance measurement is discussed, together with tolerance to abutting contaminants.
Document type :
Journal articles
Complete list of metadatas

https://hal-cea.archives-ouvertes.fr/cea-01778327
Contributor : Bruno Savelli <>
Submitted on : Wednesday, April 25, 2018 - 3:40:09 PM
Last modification on : Thursday, February 7, 2019 - 4:22:45 PM

Identifiers

Collections

CEA | DRT | LIST

Citation

Jean-Pierre Nikolovski. Moderately reverberant learning ultrasonic pinch panel. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, Institute of Electrical and Electronics Engineers, 2013, 60, pp.2105 - 2120. ⟨10.1109/TUFFC.2013.2801⟩. ⟨cea-01778327⟩

Share

Metrics

Record views

79