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Selective electroless copper deposition on self-assembled dithiol monolayers

Abstract : The paper reports the use of self-assembled monolayers (SAMs) of dithiols to induce electroless copper deposition on a gold substrate. The metallization catalyst, palladium nanoparticles, is bound on the dithiol SAM. The assembly process is followed by IR and X-ray photoelectron spectroscopies to confirm the formation of a monolayer with bound catalyst. Electroless metallization is then carried out with a steady deposition rate of 130 nm/min. Additionally, microcontact printing of the catalyst on the SAM by poly(dimethylsiloxane) stamps is used to localize copper deposits. Resulting metallization is selective and allows for a high resolution.
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https://hal-cea.archives-ouvertes.fr/cea-01022846
Contributor : Serge Palacin Connect in order to contact the contributor
Submitted on : Friday, July 11, 2014 - 8:25:28 AM
Last modification on : Thursday, November 18, 2021 - 5:28:04 PM

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Dmitry Aldakov, Yvan Bonnassieux, Bernard Geffroy, Serge Palacin. Selective electroless copper deposition on self-assembled dithiol monolayers. ACS Applied Materials & Interfaces, Washington, D.C. : American Chemical Society, 2009, 1, pp.584-589. ⟨10.1021/am8001346⟩. ⟨cea-01022846⟩

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