Selective electroless copper deposition on self-assembled dithiol monolayers

Dmitry Aldakov; Yvan Bonnassieux; Bernard Geffroy; Serge Palacin

Selective electroless copper deposition on self-assembled dithiol monolayers

Dmitry Aldakov ¹ Yvan Bonnassieux ¹ Bernard Geffroy ² Serge Palacin ^{2, *}

* Corresponding author

1 LPICM - Laboratoire de physique des interfaces et des couches minces [Palaiseau]

2 LCSI - Laboratoire de Chimie des Surfaces et Interfaces

Abstract : The paper reports the use of self-assembled monolayers (SAMs) of dithiols to induce electroless copper deposition on a gold substrate. The metallization catalyst, palladium nanoparticles, is bound on the dithiol SAM. The assembly process is followed by IR and X-ray photoelectron spectroscopies to confirm the formation of a monolayer with bound catalyst. Electroless metallization is then carried out with a steady deposition rate of 130 nm/min. Additionally, microcontact printing of the catalyst on the SAM by poly(dimethylsiloxane) stamps is used to localize copper deposits. Resulting metallization is selective and allows for a high resolution.

Keywords : electroless deposition self-assembled monolayers copper vias dithiols microcontact printing palladium nanoparticles

Document type :

Journal articles

Domain :

Chemical Sciences / Material chemistry

Complete list of metadatas

https://hal-cea.archives-ouvertes.fr/cea-01022846
Contributor : Serge Palacin <>
Submitted on : Friday, July 11, 2014 - 8:25:28 AM
Last modification on : Wednesday, March 27, 2019 - 4:20:04 PM

Selective electroless copper deposition on self-assembled dithiol monolayers

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Selective electroless copper deposition on self-assembled dithiol monolayers

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