Selective electroless copper deposition on self-assembled dithiol monolayers

Dmitry Aldakov (1) , Yvan Bonnassieux (1) , Bernard Geffroy (2) , Serge Palacin (2)

1 LPICM - Laboratoire de physique des interfaces et des couches minces [Palaiseau]
2 LCSI - Laboratoire de Chimie des Surfaces et Interfaces

The paper reports the use of self-assembled monolayers (SAMs) of dithiols to induce electroless copper deposition on a gold substrate. The metallization catalyst, palladium nanoparticles, is bound on the dithiol SAM. The assembly process is followed by IR and X-ray photoelectron spectroscopies to confirm the formation of a monolayer with bound catalyst. Electroless metallization is then carried out with a steady deposition rate of 130 nm/min. Additionally, microcontact printing of the catalyst on the SAM by poly(dimethylsiloxane) stamps is used to localize copper deposits. Resulting metallization is selective and allows for a high resolution.

Keywords: electroless deposition; self-assembled monolayers; copper vias; dithiols; microcontact printing; palladium nanoparticles

Domains: Chemical Sciences; Material chemistry

Dmitry Aldakov, Yvan Bonnassieux, Bernard Geffroy, Serge Palacin. Selective electroless copper deposition on self-assembled dithiol monolayers. ACS Applied Materials & Interfaces, 2009, 1, pp.584-589. ⟨10.1021/am8001346⟩. ⟨cea-01022846⟩