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Selective electroless copper deposition on self-assembled dithiol monolayers

Dmitry Aldakov 1 Yvan Bonnassieux 1 Bernard Geffroy 2 Serge Palacin 2, *
* Corresponding author
1 LPICM - Laboratoire de physique des interfaces et des couches minces [Palaiseau]
2 LCSI - Laboratoire de Chimie des Surfaces et Interfaces
Abstract : The paper reports the use of self-assembled monolayers (SAMs) of dithiols to induce electroless copper deposition on a gold substrate. The metallization catalyst, palladium nanoparticles, is bound on the dithiol SAM. The assembly process is followed by IR and X-ray photoelectron spectroscopies to confirm the formation of a monolayer with bound catalyst. Electroless metallization is then carried out with a steady deposition rate of 130 nm/min. Additionally, microcontact printing of the catalyst on the SAM by poly(dimethylsiloxane) stamps is used to localize copper deposits. Resulting metallization is selective and allows for a high resolution.
Keywords : electroless deposition self-assembled monolayers copper vias dithiols microcontact printing palladium nanoparticles
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https://hal-cea.archives-ouvertes.fr/cea-01022846
Contributor : Serge Palacin Connect in order to contact the contributor
Submitted on : Friday, July 11, 2014 - 8:25:28 AM
Last modification on : Tuesday, December 15, 2020 - 2:20:02 PM

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CEA | CNRS | X | X-PICM | LPICM | PUBNIMBE | X-DEP-PHYS

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Dmitry Aldakov, Yvan Bonnassieux, Bernard Geffroy, Serge Palacin. Selective electroless copper deposition on self-assembled dithiol monolayers. ACS Applied Materials & Interfaces, Washington, D.C. : American Chemical Society, 2009, 1, pp.584-589. ⟨10.1021/am8001346⟩. ⟨cea-01022846⟩

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