3D-amino-induced electroless plating process: a powerful toolset for localized metallization onto polymers substrates - Archive ouverte HAL Access content directly
Journal Articles ChemPhysChem Year : 2011

3D-amino-induced electroless plating process: a powerful toolset for localized metallization onto polymers substrates

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Abstract

The "3D amino-induced electroless plating" (3D-AIEP) process is an easy and cost-effective way to produce metallic patterns onto flexible polymer substrates with a micrometric resolution and based on the direct printing of the mask with a commercial printer. Its effectiveness is based on the covalent grafting onto substrates of a 3D polymer layer which presents the ability to entrap Pd species. Therefore, this activated Pd-loaded and 3D polymer layer acts both as a seed layer for electroless metal growth and as an interdigital layer for enhanced mechanical properties of the metallic patterns. Consequently, flexible and transparent poly(ethylene terephtalate) (PET) sheets were selectively metalized with nickel or copper patterns. The electrical properties of the obtained metallic patterns were also studied.

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cea-00960666 , version 1 (18-03-2014)

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Alexandre Garcia, Thomas Berthelot, Pascal Viel, Pascale Jégou, Serge Palacin. 3D-amino-induced electroless plating process: a powerful toolset for localized metallization onto polymers substrates. ChemPhysChem, 2011, 12, pp.2973-2978. ⟨10.1002/cphc.201100562⟩. ⟨cea-00960666⟩

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