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Gate spacers etching of Si$_3$N$_4$ using cyclic approach for 3D CMOS devices
Valentin Bacquie
,
Aurelien Tavernier
,
Francois Boulard
,
Olivier Pollet
,
Nicolas Posseme
Article dans une revue
cea-03343549v1
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The importance of sample preparation in time-of-flight secondary ion mass spectrometry analysis for semiconductor applications
Jean-Paul Barnes
,
Claire Guyot
,
Pierre Hirchenhahn
,
Tony Maindron
,
Olivier Renault
,
et al.
SISS-22 -The Scientific International Symposium on SIMS and Related Techniques Based on Ion-Solid Interactions, Jun 2023, Kanazawa, Japan
Communication dans un congrès
cea-04170890v1
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Die-Scale Nanotopography Characterization: New Insight
Viorel Balan
,
Yorrick Exbrayat
,
Sebastien Mermoz
International Conference on Planarization Technology (ICPT 2022), Sep 2022, Potsdam, United States
Communication dans un congrès
cea-04349990v1
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Development of intentional contamination in iron by bath for silicon wafers and evaluation of VPD-Bulk and LPD-Bulk for metallic contaminants analyses by ICPMS
Viviane Yim
,
Delphine Truffier-Boutry
,
Anna Mukhtarov
,
Anouk Galtayries
Article dans une revue
cea-04492799v1
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Wide bandgap material transfer as a flagship technology for future high power devices
Julie Widiez
,
Guillaume Gelineau
,
Cédric Masante
,
Jérémie Chretien
,
Alexandre Moulin
,
et al.
2023 MRS Fall - 2023 MRS Fall Meeting and Exhibit, Nov 2023, Boston, United States
Communication dans un congrès
cea-04409019v1
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Die-to-die alignment for lithographic processing of reconstructed wafers
Mikhail Loktev
,
Sylvain Misat
,
Ralph Schiedon
,
Jeroen de Boeij
,
Michiel van der Stam
,
et al.
Communication dans un congrès
cea-03956462v1
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Electrical induced cracking of PZT films and its effect on electrical properties of piezoelectric capacitors
Hugo Kuentz
,
Baba Wague
,
Nicolas Vaxelaire
,
Valérie Demange
,
Christophe Poulain
,
et al.
ISAF 2022 - 2022 IEEE International Symposium on Applications of Ferroelectrics, Jun 2022, Tours, France
Communication dans un congrès
cea-04539848v1
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3D sequential integration: applications and associated key enabling modules (design & technology)
P. Batude
,
O. Billoint
,
S. Thuries
,
P. Malinge
,
C. Fenouillet-Beranger
,
et al.
Communication dans un congrès
cea-04456122v1
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Ge–Sb–S–Se–Te amorphous chalcogenide thin films towards on-chip nonlinear photonic devices
J.-B. Dory
,
C. Castro-Chavarria
,
A. Verdy
,
J.-B. Jager
,
M. Bernard
,
et al.
Article dans une revue
cea-02903381v1
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De l'utilisation de matrices en ToF-SIMS tandem MS pour la caractérisation d'OLEDs
Pierre Hirchenhahn
,
Claire Guyot
,
Tony Maindron
,
Benoit Gilquin
,
Greg Fisher
,
et al.
1ères journées du GDR-MSI (First days of the MSI GDR), CNRS, Jun 2022, Bordeaux, France
Communication dans un congrès
cea-03836345v1
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The Photonic Atom Probe as a Tool for the Analysis of the Effect of Defects on the Luminescence of Nitride Quantum Structures
Ioanna Dimkou
,
Jonathan Houard
,
Névine Rochat
,
Pradip Dalapati
,
Enrico Di Russo
,
et al.
Article dans une revue
hal-03938973v1
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From polymer/metal hybrid materials' interface analysis to ToF-SIMS tandem MS measurement optimization.
Pierre Hirchenhahn
,
Adham Al-Sayyad
,
Julien Bardon
,
Peter Plapper
,
Laurent Houssiau
,
et al.
RCP 2021 - Rencontres de Chimie-Physique 2021, Sep 2021, Sète, France
Communication dans un congrès
cea-03616000v1
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High-Q silica microcavities on a chip: From microtoroid to microsphere
Jean-Baptiste Jager
,
Vincent Calvo
,
Eric Delamadeleine
,
Emmanuel Hadji
,
Pierre Noé
,
et al.
Article dans une revue
cea-01989341v1
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Elaboration and characterization of a 200 mm stretchable and flexible ultra-thin semi-conductor film
Laurent Michaud
,
Clément Castan
,
Marc Zussy
,
Pierre Montméat
,
Vincent H Mareau
,
et al.
Article dans une revue
cea-02534522v1
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Large improvement of CNT yarn electrical conductivity by varying chemical doping and annealing treatment
Yoann Dini
,
Denis Rouchon
,
Jérôme Faure-Vincent
,
Jean Dijon
Article dans une revue
hal-03196862v1
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Correlative analysis using time-of-flight secondary ion mass spectrometry for beam sensitive samples
Jean-Paul Barnes
,
Claire Guyot
,
Pierre Hirchenhahn
,
Amanda Gomes de Carvalho
,
Nicolas Gauthier
,
et al.
AVS69 - 69th International Symposium & Exhibition, Nov 2023, Portland, United States
Communication dans un congrès
cea-04349703v1
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Spin-orbit control of antiferromagnetic domains without a Zeeman coupling
Damaris Tartarotti Maimone
,
Junying Shen
,
Nicolas Gauthier
,
Daniel Mazzone
,
Markus Zolliker
,
et al.
2023
Pré-publication, Document de travail
hal-04364236v1
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Impact of Hydrogen on Graphene-based Materials: Atomistic Modeling and Simulation of HRSTEM Images
Cyril Guedj
,
Léonard Jaillet
,
François Rousse
,
Stephane Redon
AVS 65th International Symposium & Exhibition, Oct 2018, Long Beach, United States
Communication dans un congrès
hal-01973651v1
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Caractérisation de structures GaN par HAXPES pour l'électronique de puissance
Tarek Spelta
,
Eugénie Martinez
,
Marc Veillerot
,
Pedro Fernandes Paes Pinto Rocha
,
Sarah Boubenia
,
et al.
JNSPE 2022 - Journées Nationales des Spectroscopies de PhotoEmission, May 2022, Dijon, France
Communication dans un congrès
cea-04325037v1
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High-energy photoelectron spectroscopy of Si(100) with Cr Kα excitation
Pierre-Marie Deleuze
,
Kateryna Artyushkova
,
Eugénie Martinez
,
Olivier Renault
Article dans une revue
cea-03564239v1
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Shape and roughness extraction of line gratings by small angle X-ray scattering : statistics and simulations
Jérôme Reche
,
Patrice Gergaud
,
Yoann Blancquaert
,
Maxime Besacier
,
Guillaume Freychet
Article dans une revue
cea-04249757v1
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Lab-scale Hard X-ray Photoelectron Spectroscopy for the analysis of buried interfaces in device technologies
Pierre-Marie Deleuze
,
Eugénie Martinez
,
Kateryna Artyushkova
,
Olivier Renault
HAXPES 2022 - The 9th International Conference on Hard X-ray Photoelectron Spectroscopy, May 2022, Himeji, Japan
Communication dans un congrès
cea-04325036v1
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Grain to grain heterogenities in PbZrTiO$_3$ thin film as probed by in-situ biasing XRD
Kien Nguyen
,
Stephen Leake
,
Patrice Gergaud
,
Nicolas Vaxelaire
E-MRS Spring Meeting 2022, May 2022, Strasbourg, France
Communication dans un congrès
cea-04327461v1
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Microelectronic applications of in-situ FIB sectioning in the TOF-SIMS
Jean-Paul Barnes
,
Gregory L. Fisher
SIMS Europe 2023, Sep 2023, Nottingham, United Kingdom
Communication dans un congrès
cea-04349704v1
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Understanding of a new approach for silicon nitride spacer etching using gaseous hydrofluoric acid after hydrogen ion implantation
Vincent Ah-Leung
,
Olivier Pollet
,
Nicolas Posseme
,
Maxime Garcia Barros
,
Névine Rochat
,
et al.
Article dans une revue
cea-02202455v1
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New directions in the analysis of buried interfaces for device technology by hard X-ray photoemission
Olivier Renault
,
Pierre-Marie Deleuze
,
Jules Courtin
,
Rose Taylor Bure
,
Nicolas Gauthier
,
et al.
Article dans une revue
cea-03607502v1
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Determination of free carrier concentration of polar semiconductors using LOPC modes: an example of InP
Van-Hoan Le
,
Emmanuel Nolot
,
Carla Crobu
,
Christelle Navone
RamanFest 2022 - The 9th International Conference on Advanced Applied Raman Spectroscopy, Sep 2022, Paris, France
Communication dans un congrès
cea-04196709v1
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High-energy photoelectron spectroscopy of Si3N4 thin film on Si with Cr Kα excitation
Pierre-Marie Deleuze
,
Kateryna Artyushkova
,
Eugénie Martinez
,
Olivier Renault
Article dans une revue
cea-03564235v1
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HAXPES reference spectra of bulk Mo and MoSe$_2$ with Cr $K_\alpha$ excitation
Pierre-Marie Deleuze
,
Nicolas Gauthier
,
Kateryna Artyushkova
,
Eugénie Martinez
,
Olivier Renault
Article dans une revue
cea-04513201v1
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Biaxial piezoelectric MEMS mirrors with low absorption coating for 1550 nm long-range LIDAR
Laurent Mollard
,
Jordi Riu
,
Santiago Royo
,
Christel Dieppedale
,
Antoine Hamelin
,
et al.
Article dans une revue
cea-04552097v1
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