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Exploring charge hopping transport in amorphous HfO$_2$: An approach combing $ab\ initio$ methods and model Hamiltonian

 Youssef Hirchaou , Benoit Sklenard , Wolfgang Goes , Philippe Blaise , François Triozon , et al.
Applied Physics Letters, 2024, 124, pp.052108
Article dans une revue cea-04530721v1

Structural and Electrostatic Confinement of a Single Electron in a Scalable 2D Array of Quantum Dots

 Amina Sadik , Etienne Nowak , Louis Hutin , Pierre-André Mortemousque , Benoit Bertrand
silicon nanoelectronics workshop SNW, Jun 2023, Kyoto, Japan
Communication dans un congrès cea-04271883v1
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Conception, caractérisation et intégration d'un système de balayage laser en Photonique sur Silicium pour des applications de détection LIDAR à 1.55µm

 Cyrille Barrera
Optique / photonique. Université Paris-Saclay, 2023. Français. ⟨NNT : 2023UPAST041⟩
Thèse tel-04368954v1
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Wide bandgap material transfer as a flagship technology for future high power devices

 Julie Widiez , Guillaume Gelineau , Cédric Masante , Jérémie Chretien , Alexandre Moulin , et al.
2023 MRS Fall - 2023 MRS Fall Meeting and Exhibit, Nov 2023, Boston, United States
Communication dans un congrès cea-04409019v1
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Transfer of AlGaAs/GaAs crystalline Bragg mirror from a GaAs substrate to a fused silica substrate by direct bonding

 Victor Hui , Agathe André , Alexandre Arnoult , P Besson , Christophe Dubarry , et al.
SPIE Photonics Europe, Apr 2022, Strasbourg, France
Communication dans un congrès cea-03735678v1
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Electrical induced cracking of PZT films and its effect on electrical properties of piezoelectric capacitors

 Hugo Kuentz , Baba Wague , Nicolas Vaxelaire , Valérie Demange , Christophe Poulain , et al.
ISAF 2022 - 2022 IEEE International Symposium on Applications of Ferroelectrics, Jun 2022, Tours, France
Communication dans un congrès cea-04539848v1
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Specificities of linear Si QD arrays integration and characterization

 Heimanu Niebojewski , Benoit Bertrand , Etienne Nowak , Thomas Bedecarrats , Bruna Cardoso Paz , et al.
VLSI 2022 - 2022 IEEE Symposium on VLSI Technology and Circuits, Jun 2022, Honolulu, United States. pp.415-416, ⟨10.1109/VLSITechnologyandCir46769.2022.9830352⟩
Communication dans un congrès cea-04538826v1
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État de l'art de la recherche vers une électronique de puissance soutenable

 Bruno Allard , Morgan Almanza , Matthieu Beley , H. Ben Ahmed , Daniel Chatroux , et al.
Symposium de Génie Electrique (SGE2023), Jul 2023, Lille, France
Communication dans un congrès hal-04244521v1

3D sequential integration: applications and associated key enabling modules (design & technology)

 P. Batude , O. Billoint , S. Thuries , P. Malinge , C. Fenouillet-Beranger , et al.
2021 IEEE International Electron Devices Meeting (IEDM), Dec 2021, San Francisco, France. pp.3.2.1-3.2.4, ⟨10.1109/IEDM19574.2021.9720671⟩
Communication dans un congrès cea-04456122v1

Novel fine-grain back-bias assist techniques for 3D-monolithic 14 nm FDSOI top-tier SRAMs

 D. Bosch , X. Garros , A. Makosiej , L. Ciampolini , O. Weber , et al.
Solid-State Electronics, 2020, 168, pp.107720. ⟨10.1016/j.sse.2019.107720⟩
Article dans une revue hal-04444371v1

Contact resistances in trigate and FinFET devices in a non-equilibrium Green's functions approach

 Leo Bourdet , Jing Li , Johan Pelloux-Prayer , Francois Triozon , Mikael Casse , et al.
Journal of Applied Physics, 2016, 119 (8), pp.084503. ⟨10.1063/1.4942217⟩
Article dans une revue cea-01849341v1
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Indirect electrical-control through heating of a GeTe phase change switch and Its application to reflexion type phase shifting

 Ayoub Naoui , Bruno Reig , Etienne Perret , Mohamad El-Chaar , Florence Podevin
IMAS 2023 - International Microwave & Antennas Symposium 2023, Feb 2023, Le Caire, Egypt. pp.13-16, ⟨10.1109/IMAS55807.2023.10066891⟩
Communication dans un congrès cea-04528482v1
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Powering AI at the edge: A robust, memristor-based binarized neural network with near-memory computing and miniaturized solar cell

 Fadi Jebali , Atreya Majumdar , Clément Turck , Kamel-Eddine Harabi , Mathieu-Coumba Faye , et al.
Nature Communications, 2024, 15 (1), pp.741. ⟨10.1038/s41467-024-44766-6⟩
Article dans une revue hal-04442577v1
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Preliminary design of a flexible haptic surface

 Romain Le Magueresse , Frédéric Giraud , Fabrice Casset , Anis Kaci , Brigitte Desloges , et al.
Hasti Seifi; A. M. L. Kappers; et al. Haptics: Science, Technology, Applications. EuroHaptics 2022., 13235, Springer, pp.207-215, 2022, Lecture Notes in Computer Science, 978-3-031-06249-0. ⟨10.1007/978-3-031-06249-0_24⟩
Chapitre d'ouvrage cea-03713105v1
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Operando confocal microscopy to analyse volume expansion of Solid State Microbatteries

 Lara Casiez , Christophe Secouard , Jacopo Cele , Jean-Philippe Colonna , Alberto Aguerri , et al.
244th ECS Meeting, Oct 2023, Göteborg, Sweden
Communication dans un congrès cea-04539850v1
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Empreinte environnementale d'un composant de puissance à base de GaN

 Gabin Guillemaud , Laura Vauche , João-Carlos Lopes Barbosa , Véronique Sousa , Léa Di Cioccio
SGE 2023 - 5ème édition du Symposium de Génie Électrique, Jul 2023, Lille, France. pp.1
Communication dans un congrès cea-04539849v1
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Haptic interface based on an innovative piezo-in-flex piezoelectric patch technology

 Fabrice Casset , Munique Kazar Mendes , Nadine David , Rémi Franiatte , Daniel Mermin , et al.
Transducers 2023 - The 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Jun 2023, Kyoto, Japan. , 2023
Poster de conférence cea-04539832v1

Mosaic: in-memory computing and routing for small-world spike-based neuromorphic systems

 Thomas Dalgaty , Filippo Moro , Yiğit Demirağ , Alessio de Pra , Giacomo Indiveri , et al.
Nature Communications, 2024, 15 (1), pp.142. ⟨10.1038/s41467-023-44365-x⟩
Article dans une revue cea-04456059v1

Dual-port reflectometry technique: Charge identification in nanoscaled single-electron transistors

 Alexei O. Orlov , P. Fay , G. Snider , Xavier Jehl , Sylvain Barraud , et al.
IEEE Nanotechnology Magazine, 2015, 9 (2), pp.24-32. ⟨10.1109/mnano.2015.2409411⟩
Article dans une revue cea-01734601v1

Interfacial chemistry in a ZnTe/CdSe superlattice studied by atom probe tomography and transmission electron microscopy strain measurements

 B. Bonef , B. Haas , J-L. Rouvière , R. André , C. Bougerol , et al.
Journal of Microscopy, 2016, 262 (2), pp.178 - 182. ⟨10.1111/jmi.12340⟩
Article dans une revue hal-01390785v1

Capteur biologique et/ou biochimique et/ou chimique

 Thomas Alava , Pascal Mailley , Yanxia Hou-Broutin , Loïc Leroy
France, N° de brevet: FR2005584. 2020
Brevet hal-02946499v1

M3D-ADTCO: Monolithic 3D architecture, design and technology co-optimization for high energy efficient 3D IC

 Sebastien Thuries , Olivier Billoint , Sylvain Choisnet , Romain Lemaire , Pascal Vivet , et al.
2020 Design, Automation & Test in Europe Conference & Exhibition (DATE), Mar 2020, Grenoble, France. pp.1740-1745, ⟨10.23919/DATE48585.2020.9116293⟩
Communication dans un congrès cea-03288836v1
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Enhanced thermal stability of Ni/GeSn system using pre-amorphization by implantation

 A. Quintero , F. Mazen , P. Gergaud , N. Bernier , J.-M. Hartmann , et al.
Journal of Applied Physics, 2021, 129 (11), ⟨10.1063/5.0038253⟩
Article dans une revue hal-04458552v1
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Highly transparent PZT capacitors on glass obtained by layer transfer process

 Gwenael Le Rhun , Franklin Pavageau , Baba Wague , Pierre Perreau , Christophe Licitra , et al.
Journal of Materials Science: Materials in Electronics, 2022, 33, pp.26825-26833. ⟨10.1007/s10854-022-09347-7⟩
Article dans une revue cea-03920655v1
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Experimental demonstration of Single-Level and Multi-Level-Cell RRAM-based In-Memory computing with up to 16 parallel operations

 Eduardo Esmanhotto , T. Hirtzlin , N. Castellani , S. Martin , B. Giraud , et al.
IRPS 2022 - IEEE International Reliability Physics Symposium, Mar 2022, Dallas, United States. pp.P8-1-P8-4, ⟨10.1109/IRPS48227.2022.9764474⟩
Communication dans un congrès hal-04442653v1

A 5500-frames/s 85-GOPS/W 3-D Stacked BSI Vision Chip Based on Parallel In-Focal-Plane Acquisition and Processing

 Laurent Millet , Stéphane Chevobbe , Caaliph Andriamisaina , Lamine Benaissa , Edouard Deschaseaux , et al.
IEEE Journal of Solid-State Circuits, 2019, 54 (4), pp.1096-1105. ⟨10.1109/JSSC.2018.2886325⟩
Article dans une revue cea-02186449v1
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Electromigration assessment in power grids with account of redundancy and non-uniform temperature distribution

 Armen Kteyan , Valeriy Sukharev , Alexander Volkov , Jun-Ho Choy , Farid Najm , et al.
ISPD'23 - International Symposium on Physical Design, Mar 2023, Virtual event USA, United States. pp.124-132
Communication dans un congrès cea-04088213v1

Field Effect Depletion Regions exploiting different Qox polarities for Interface Passivation in High-Resistivity Silicon Substrates

 Maxime Moulin , Thibaud Fache , Martin Rack , Christophe Plantier , Jose Lugo , et al.
VLSI-TSA, Apr 2023, Hsinchu, Taiwan. ⟨10.1109/VLSI-TSA/VLSI-DAT57221.2023.10133956.⟩
Communication dans un congrès cea-04139268v1

Impact of non-equilibrium transport and series resistances in 0.1um bulk and SOI MOSFETs

 Bricout Paul-Henri , Emmanuel Augendre , Emmanuel Dubois
27th European Solid-State Device Research Conference, Sep 1997, Stuttgart (Germany), Germany
Communication dans un congrès hal-04248535v1

Memory Window in Si:HfO2 FeRAM arrays: Performance Improvement and Extrapolation at Advanced Nodes

 Julie Laguerre , Marc Bocquet , Olivier Billoint , Simon Martin , Jean Coignus , et al.
International Memory Workshop, May 2023, Monterey, United States
Communication dans un congrès cea-04249417v1
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